Intel confirmed at a recent Goldman Sachs Technology conference that it plans to launch a refresh of its Arrow Lake processors "next year," with its true next-generation Nova Lake designs to follow along before the end of 2026

The DRAM market is flashing mixed signals as 2025 enters its final stretch. According to findings published by Digitimes, DDR4 spot prices have stabilized after a frenzied second quarter, yet contract pricing continues to rise as supply remains tight.

The road is almost over for AMD's Zen 3-based 3D-VCache-powered gaming processors. Tweakers.net reports that various retailers can no longer purchase the Ryzen 7 5700X3D from AMD, thus confirming the CPU has reached end-of-life status.

Intel’s lack of a proper answer to AMD’s Strix Halo—and by extension, Apple’s M-series—has left a clear gap in the high-end APU space. The Blue Team hasn’t seriously competed in the graphics-focused mobile market for a while, but that might be about to change.

DRAM prices are expected to climb sharply in the third quarter of 2025, with increases of up to 45% depending on the product, according to TrendForce. This price surge will reportedly be driven by capacity reallocations, product phase-outs, and demand from both AI servers and seasonal consumer trends.

Intel's upcoming Nova Lake chips are expected to advance their modular design philosophy by bringing together future Xe3 and Xe4 IPs to handle different engines on the chip. Jaykihn, an avid Intel leaker, asserts that Nova Lake-S will allegedly use Celestial for its graphics engine.

Patriot has brought a plethora of new products to Computex 2025, including high-performance DDR5 memory, bleeding-edge SSDs, and hubs. The Viper Xtreme 5 CKD is a new DDR5 CUDIMM memory module featuring data speeds of up to a whopping 9600MT/s.

AMD on Tuesday introduced its Zen 5-based EPYC 4005-series processors aimed at entry-level uniprocessor servers for small businesses, edge deployments, and hosting providers.

Qualcomm's team seems to be in the final development stages of its second-generation Snapdragon X processors for client PCs, and it looks like it is about time for the first leaks about the CPU performance to emerge.

Intel has made significant strides in implementing High-NA EUV lithography by installing two High-NA litho machines, developing custom reticles as well as all-new optical proximity correction, and processing 30,000 wafers.

Last CES saw AMD unveil its Ryzen 8000G lineup of APUs for AM5, bringing together speedy Zen 4 cores alongside the first RDNA-based graphics engine to desktops, succeeding their Vega-powered predecessors.