G.Skill introduced two new high-performance DDR5 memory kits aimed at Intel platforms, one focusing on high-performance paired with high-capacity and the other centered around low-latency performance.

Shipping records indicate that Intel's Nova Lake chips are currently undergoing validation (via x86deadandback at NBD). Nova Lake is the successor to Intel's Arrow Lake series of processors and is expected to debut in 2026-27.

AMD has launched its Ryzen AI 300 and Ryzen 200 series of mobile processors at CES 2025 at Las Vegas, debuting a total of 15 new models, across the PRO and non-PRO stack for mainstream and commercial laptops.

In the first sign of changes to come after the formation of a new industry group, Intel has confirmed to Tom's Hardware that it is no longer working on the x86S specification.

Traditional DDR memory operates within a certain temperature window—often around 100 degrees Celsius or less—and going beyond that window will result in potential data loss and thermal throttling. Researchers at the University of Michigan have developed a new memory architecture

When Zhaoxin, a joint venture between Via Technologies and Shanghai Municipal Government, introduced its KaiXian KX-7000 series of x86 processors in late 2023, it implied that the new CPUs will offer tangible performance improvements over its predecessors as they were based on a brand-new microarchitecture.

AMD is allegedly planning to refresh its Ryzen 8040 or Hawk Point lineup of APUs using the new Ryzen 200 branding—possibly by CES 2025—per the Golden Pig Upgrade Pack. This is to better align AMD's upcoming offerings—including refreshes—with its existing Ryzen AI 300 series

Intel has released the company's Core Ultra 200S (codenamed Arrow Lake) in the shape of the K-series chips, such as the Core Ultra 9 285K, which competes against the best CPUs. The non-K SKUs will arrive later; Benchleaks has uncovered an unannounced Core Ultra 7 265 in a Geekbench 6 GPU result.

Asus's new short NitroPath RAM slot design, arriving on select Asus X870E and Z890 motherboards, boosts RAM speeds by up to 400 MT/s by cutting down on harmful electrical interference from empty RAM slots.

Ryzen 9000 launched with unexpectedly high cross-CCD latency on the dual-CCD models — Ryzen 9 9900X and Ryzen 9 9950X. However, AMD has now rectified the issue with a new AGESA microcode update that cuts the Ryzen 9 9900X and Ryzen 9 9950X's cross-CCD latency in half.

In a surprise move, Intel announced today that it no longer plans to use its own 'Intel 20A' process node with its upcoming Arrow Lake processors for the consumer market. Instead, it will use external nodes, likely from partner TSMC, for all of Arrow Lake's chip components.

Samsung is set to tape out its first HBM4 memory devices later this year with sampling set to begin in early 2025, reports nN Elec citing industry sources. The company is projected to use its latest-generation 10nm-class DRAM fabrication process to make HBM4 DRAM devices as well as its 4nm-class logic technology to produce HBM4 base dies, the report says.